Team 04: Project WASP
Above: The final physical assembly of Project Wasp (Wafer Automated Surface Profiler). Project WASP explores non-contact silicon wafer measurement methods for the semiconductor industry for quality control.
Project WASP explores non-contact methods of measuring silicon wafers for the semiconductor industry. The team developed an automated wafer transfer system enclosed in a test bench and a measurement system to determine surface profiles while the wafer is moving. This measurement must be taken in parallel with existing operations in order to minimize any effects of throughput to the system.
Sponsorship
Sponsored by KLA Corporation
Director
Paul Brayford
[video:https://youtu.be/fkpjhM6r96Y]
Team Members
- Summer Andrews - Systems/Test Engineer
- Sean Connelly - CAD/Software Engineer
- Jackson Hughes - Logistics Manager
- Abigail Oglesby - Financial Manager
- Behruz Rashidov - Project Manager
- Nicholas Sanchez Tennis - Manufacturing Engineer