CAD Rendering of the Final Assembly of Project SWCFI (Silicon Wafer Center-Finding Improvement). This project explores improving the inspection process of silicon wafers for quality control in the semiconductor industry.
Our team worked to improve the center-finding process used in the inspection of silicon wafers. The project’s goal is to find the wafer’s center to 10-micron accuracy in under 2 seconds. The center is the origin of a coordinate grid that is used to locate defects. The test bench implements a custom algorithm and high-magnification cameras to inspect the wafer profile and log the center position.