NSF Enabling Quantum Leap: Quantum Interconnect Challenges for Transformational Advances in Quantum Systems (QuIC-TAQS)

Please see the full solicitation for complete information about the funding opportunity. Below is a summary assembled by the Research & Innovation Office (RIO).

Program Summary

The Quantum Interconnect Challenges for Transformational Advances in Quantum Systems (QuIC - TAQS) program is designed to support interdisciplinary teams that will explore highly innovative, original, and potentially transformative ideas for developing and applying quantum science, quantum computing, and quantum engineering in the specific area of quantum interconnects. Quantum interconnects are an integral part of all aspects of quantum information science. Proposals should have the potential to deliver new concepts, new platforms, and/or new approaches that will implement the transfer of quantum states efficiently across platforms and over large length scales. Progress in the area of quantum interconnects will enable breakthroughs in quantum sensing, quantum communications, quantum simulations, and quantum computing systems. This Quantum Interconnect Challenges solicitation will support the process of translating such ideas into reality.

This solicitation calls for proposals focused on interdisciplinary research that enhances the development of quantum interconnects (QuIC) that would allow the transfer of quantum states between different physical states and/or different physical systems. Proposals must articulate how the project leverages and/or promotes advances in quantum interconnects. Proposals should be innovative and must focus on quantum functionality and must result in experimental demonstrations and/or transformative advances towards quantum systems and/or proof-of-concept validations. Competitive proposals will come from an interdisciplinary research team led by at least three investigators who collectively contribute synergistic expertise from a subset of the following domains: engineering, mathematics, computational science, computer/information science, physical, chemical, biological, material science. Proposals will be judged on how likely the integrated effort is to lead to transformative advances in quantum interconnection.


CU Internal Deadline: 11:59pm MST February 8, 2021

Sponsor Preliminary Proposal Deadline: 5:00pm MST April 12, 2021

Sponsor Full Proposal Deadline: 5:00pm MST June 14, 2021

Internal Application Requirements (all in PDF format)

  • Project Description (3 pages maximum): Please include the following: 1) Vision and Goals: Describe the vision and specific goals of the proposed research, explicitly addressing how the different PIs and research topics mesh together to achieve the research goals; 2) Approach and Methodology: Describe the approach and methodology that will be used to achieve the research vision and goals; 3) Relevance to Quantum Interconnects: Describe how the project leverages and/or promotes advances in quantum interconnects.
  • PI Curriculum Vitae
  • List of Key Personnel (1 page maximum): Include a succinct description of what each person uniquely brings to the project and how they are integrated to produce positive synergies.
  • Budget Overview (1 page maximum): A basic budget outlining project costs is sufficient; detailed OCG budgets are not required.

To access the online application, visit: https://cuboulderovcr.secure-platform.com/a/solicitations/6572/home


There are no special eligibility requirements.

Limited Submission Guidelines

Only one preliminary proposal may be submitted per lead institution.

Award Information

Expected Number of Awards: 10-12

Anticipated funding amount is pending availability of funds. Each project team may receive support of up to a total of $2,500,000 over the project duration of 4 years. It is not expected that all awards will receive the maximum amount; the size of awards will depend upon the type of research program proposed. The budget must be commensurate with the scope of the project and thoroughly justified in the proposal.