Proceedings (Peer-reviewed)

  • “In situ measurements of annealing-induced line shape decay in nanoimprinted polymers using scatterometry”. Patrick, H.; Germer, T., Ding, Y., Ro, H., Richter, L., Soles, C. Proceedings of SPIE, 2009,7271. 727128.
  • “The role of stress in nanoimprint lithography”, Ro, H.; Ding, Y.; Lee, H.; Hines, D.; Jones, R.; Lin, E.; Alamgir, K.; Wu, W.; Soles, C. Proceedings of SPIE, 2006, 6151, 615116.
  • “Water absorption and corrosion protection of esterified novolac resin cured epoxy resins applicable for microelectronics packing”, Li, S.; Tang, X.; Ding, Y.; Liu, M. Proceedings of Fifth International Conference on Electronic Packaging Technology, 2003, 343-344.