Books Published

  1. Optoelectronic packaging, John Wiley and Sons, editors: Alan R. Mickelson, N. Bassavahally, and Y. C. Lee, 1997.
  2. Manufacturing challenges in electronic packaging, editors: Y. C. Lee and W. T. Chen, Chapman and Hall Pub., 1998.
  3. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Two-Volume Book, ed. by E. Suhir, Y. C. Lee and C. P. Wong, Springer, 2007.
  4. MEMS Packaging, editors: Y. C. Lee, Y. T. Cheng, and Ramesh Ramadoss, World Scientific Publishing, February 2018

Ten Recent Representative Publications

  1. Characterization of hybrid wicking structures for flexible vapor chambers, Dylan P. McNally, Ryan Lewis, and Y. C. Lee, ASME Journal of Electronic Packaging, March 2019, Vol. 141 / 011005-1.
  2. Design of Thermal Ground Planes for Cooling Foldable Smartphones, Ali Nematollahisarvestani, Ryan Lewis, and Y. C. Lee, ASME Journal of Electronic Packaging, June 2019, Vol. 141 / 021004-1.
  3. Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer, Wen R, Xu S, Ma X, Lee Y-C, Yang R., JOULE. 2 (2) (February 21, 2018): 269-279.
  4. Liquid-Vapor Phase-Change Heat Transfer on Functionalized Nanowired Surfaces and Beyond. Wen R, Ma X, Lee Y-C, Yang R. "JOULE. 2 (11), Nov. 21, 2018; 2307-2347.
  5. Capillary-Driven Liquid Film Boiling Heat Transfer on Hybrid Mesh Wicking Structures, R. Wen, Shanshan Xu, Y. C. Lee and Ronggui Yang, Nano Energy, 51, June 2018, pp. 373-382.
  6. Introduction to MEMS Packaging, Y. C. Lee, Ramesh Ramadoss and Nils Hoivik, a chapter in MEMS Packaging, ed. by Y. C. Lee, Y. T. Cheng and Ramesh Ramadoss, World Scientific Publishing, February 2018, pp. 1-30.
  7. Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays. Wen R, Li Q, Wang W, Latour B, Li CH, Li C, Lee Y-C, Yang R., Nano Energy, 38 (August 01, 2017): 59-65.
  8. Hierarchical Superhydrophobic Surfaces with Micropatterned Nanowire Arrays for High-Efficiency Jumping Droplet Condensation,Wen R, Xu S, Zhao D, Lee Y-C, Ma X, Yang R., ACS Applied Materials & Interfaces, 9 (51) (December 27, 2017): 44911-44921.
  9. Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer, Wen R, Xu S, Ma X, Lee Y, Yang R., Joule. 2 (2017): 1-11.
  10. Flexible Thermal Ground Planes Fabricated with Printed Circuit Board Technology. Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang and Y. C. Lee, ASME. J. Electron. Packag. March, 2017, Volume 139, 011003, 10 pages.