Yung-Cheng (YC) Lee received his BSME degree from the National Taiwan University in 1978, and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and 1984, respectively.
Dr. Lee is the S. J. Archuleta Professor at the Department of Mechanical Engineering. He was the Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT) and the Administrative Director of the university’s Nanomaterials Characterization Facility from 2006 to 2012. From 1993 to 2002, he served as an Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.
Dr. Lee is the Editor of ASME Journal of Electronic Packaging with a support by about 20 Associated Editors and Guest Editors. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. Dr. Lee was an Associated Editor of the ASME Journal of Electronic Packaging from 2001 to 2004 and served as a Guest Editor from 2013 to 2014. He was a Guest Editor for the IEEE Transaction on Advanced Packaging in 2003, 2005 and 2007.
Dr. Lee is also the President and CEO of Kelvin Thermal Technologies, Inc.