Yung-Cheng (YC) Lee received his BSME degree from the National Taiwan University in 1978, and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and 1984, respectively.
Y. C. Lee is a Professor of Mechanical Engineering at the University of Colorado - Boulder. From 2006 to 2012, he was the Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT). From 1993 to 2002, he was the Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode). Prior to joining the University, he was at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr. Lee's research focuses on the integration of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) with microelectronic, optoelectronic and microwave devices. Dr. Lee is the Editor of ASME Journal of Electronic Packaging (2014 ¡V 2019). He was an Associate Editor of the journal from 2002 to 2004. He also served as a Guest Editor for special issues on Packaging for Micro/Nano-Scale Systems for IEEE Transaction on Advanced Packaging (2003, 2005 and 2007). He is an ASME Fellow and has received the following awards: Presidential Young Investigator (NSF, 1990); Outstanding Young Manufacturing Engineer Award (SME, 1992); Outstanding Paper Award (IEEE-ECTC, 1991); Outstanding Paper Award (ASME J. of Electronic Packaging, 1993); Honorable Mention Paper Award (IEEE Transactions on Advanced Packaging, 2003); Meritorious Paper Award (GOMACTech-03); CU-ME Woodward Outstanding Mechanical Engineering Faculty Award, 2005-2006; ASME Electronic and Photonic Packaging Division¡¦s Mechanics Award in 2007; CU-ME Department Outstanding Service Award, 2008; ASME InterPACK Achievement Award, 2013; CU-ME Department Woodward Award, 2014; and CU-ME Department Outstanding Service Award, 2015.