Professional Publications
Additional publications can be found on Google Scholar.
2025
A. Rao, E. Bogatin and M. Piket-May, "Metrics for Acceptable Oscilloscope Bandwidth," in IEEE Transactions on Instrumentation and Measurement, vol. 74, pp. 1-8, 2025, Art no. 2008208, doi: 10.1109/TIM.2025.3556197. link
Bogatin, Lettang, All of Capstone in a Day Project, ASEE Rocky Mountain Section conference.
2024
A. Rao, E. Bogatin, M. Piket-May and M. F. Hadi, "Non-TEM Dispersion in Microstrip Structures at High Data Rates," in IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 178-185, 2024, doi: 10.1109/TSIPI.2024.3493817.
Bogatin, Mona ElHelbawy, Introductory Circuits and Electronics Remote Labs: Design, Implementation, and Lessons Learned, 2024 ASEE Annual Conference & Exposition
2023
E. Bogatin, "S-parameters for high-speed digital engineers: A beginner’s guide," IEEE Electromagnetic Compatibility Magazine, vol. 12, no. 1, pp. 34-41, 2023. Available: Link
A. Rao, E. Bogatin, M. Piket-May and M. Hadi, "A New Perspective on Quasi-TEM Behavior in Microstrip Transmission Lines," 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2023, pp. 1-3, doi: 10.1109/EPEPS58208.2023.10314872. link
Bogatin, ElHelbawy, Measure Bode Plots in 5 Minutes, 2023 ASEE Rocky Mountain Section Conference,
Bogatin, ElHelbawy, A Practical Application of Thevenin Circuit Model, 2023 ASEE Rocky Mountain Section Conference,
2022
A. Rao, E. Bogatin, M. Piket-May, D. Schofield, B. Sankarshanan, and A. Srivastava, "Analysis of a TDR technique to measure dielectric constant," in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA, Aug. 1–5, 2022, doi: 10.1109/9889566. Available: Link
E. Bogatin, "What’s new in signal integrity and high-speed serial links: Approaching the fundamental limits of copper interconnects," IEEE Microwave Magazine, vol. 23, no. 5, pp. 84-95, 2022, doi: 10.1109/MMM.2022.3148810. Available: Link
2021
T. W. Lee, F. de Paulis, M. Resso, M. Piket-May and E. Bogatin, "Non-destructive PCB Substrate Height Extraction with Multi-Measurement Technique," 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), Siegen, Germany, 2021, pp. 1-4, doi: 10.1109/SPI52361.2021.9505208. Available: Link
A. Rao, S. Sawant, E. Bogatin and M. Piket-May, "Impact of Copper Pour on Crosstalk: Measurement and Simulation Correlation," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, USA, 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609111. link
F. Deek, M. Piket-May and E. Bogatin, "Novel low cost launch for measuring via-to-cavity coupling," 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA, 2021, pp. 1-3, doi: 10.1109/EDAPS53774.2021.9657023. link
2019
E. Bogatin, S. Sandler, L. Smith, "Power Distribution Network (PDN) Impedance and Target Impedance," PDNpowerintegrity.com. Available: https://drive.google.com/file/d/1f9RKPz12ENGMFsPvlCUrN6dzO9qU0i0r/view?usp=sharing.
2018
F. Deek, M. Piket-May and E. Bogatin, "Transfer Impedance Drop off in Power/Ground Plane Cavities," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 105-109, doi: 10.1109/EMCSI.2018.8495309.
L. Smith and E. Bogatin, "Principles of Power Integrity for PDN Design," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-74, doi: 10.1109/EMCSI.2018.8495411.
E. Bogatin, "Essential Principles of Cross Talk and Mitigation Strategies," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-29, doi: 10.1109/EMCSI.2018.8495242. link.
2017
E. Bogatin, B. Hargin, V. S. S. T. Paladugu, D. DeGroot, A. Koul, S. Baek, and M. Sapozhnikov, "New characterization technique for glass-weave skew," Signal Integrity Journal, Mar. 2, 2017. [Online]. Available: https://www.researchgate.net/publication/327079248. Available: Link
E. Bogatin and K. Radhakrishna, "Synthesis of high speed channels from shorter elements," in IEEE Electromagnetic Compatibility Magazine, vol. 6, no. 1, pp. 85-90, First Quarter 2017, doi: 10.1109/MEMC.2017.7931991. Available: Link
H. Barnes, E. Bogatin and J. Moreira, "Development of a PCB kit for s-parameter de-embedding algorithms verification," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA, 2017, pp. 510-515, doi: 10.1109/ISEMC.2017.8077923. Available: Link
M. Resso, E. Bogatin, and A. Vatsyayan, "A new method to verify the accuracy of de-embedding algorithms," in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3. Available: Link
2016
A. P. Duffy, G. Zhang, C. Luk, E. Bogatin and C. -C. Huang, "Assessing techniques to compare signal integrity data for high speed interconnects," 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), Ottawa, ON, Canada, 2016, pp. 455-460, doi: 10.1109/ISEMC.2016.7571691. link
2013
E. Bogatin, D. DeGroot, P. Huray, Y. Shlepnev, "Which One is Better? Comparing Options to Describe Frequency Dependent Losses" (2013). Faculty Publications. 1665.
Available: https://digitalcommons.andrews.edu/pubs/1665
E. Bogatin, L. Simonovich, "Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias," [Online]. (2013). Design Con 2013. Available: https://drive.google.com/file/d/1nDuMC021lheYgRGuCnG-bmw620sWHVkj/view?usp=sharing.
2011
E. Bogatin, "Essential principles of signal integrity," IEEE, 2011, doi: 10.1109/MMM.2011.941411. Available: Link
L. Simonovich, E. Bogatin, and Y. Cao, "Differential via modeling methodology," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 722-730, 2011. https://doi.org/10.1109/TCPMT.2010.2103313 Available: Link
2010
A. Ciccomancini Scogna and E. Bogatin, "Analysis of return path discontinuities in multilayer PCBs and their impact on the signal and power integrity," IEEE, 2010. Available: Link
E. Bogatin, Signal and Power Integrity—Simplified, 2nd ed. Upper Saddle River, NJ, USA: Prentice Hall PTR, 2010. ISBN: 978-0-13-234979-6. Available: Link
2009
M. Resso and E. Bogatin, Signal Integrity Characterization Techniques, 2nd ed. Chicago, IL, USA: International Engineering Consortium, 2009. ISBN: 978-1-931695-93-0. Available: Link
2007
E. Bogatin, "Tracking transmission line losses," Printed Circuit Design & Fab, Jan. 2007. [Online]. Available: https://www.researchgate.net/publication/293520416_Tracking_transmission_line_losses.
2004
J. Andes and E. Bogatin, "The socket response to current packaging and test trends," IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585), San Jose, CA, USA, 2004, pp. 97-99, doi: 10.1109/IEMT.2004.1321639. link
2000
E. Bogatin, "A closed-form analytical model for the electrical properties of transmission lines for digital interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, vol. 23, no. 3, pp. 282–289, 2000. Available: Link
1991
F. Perezalonso, B. Crawford, R. Bernard, R. Kaw, S. Thomas and E. Bogatin, "Electrical characterization of VLSI packages," 1991 Proceedings 41st Electronic Components & Technology Conference, Atlanta, GA, USA, 1991, pp. 62-69, doi: 10.1109/ECTC.1991.163855. link
1990
E. Bogatin, "A closed form analytical model for the electrical properties of microstrip interconnects," in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 2, pp. 258-266, June 1990, doi: 10.1109/33.56155. link
1989
E. Bogatin, P. Ghandi, G. Weihe, S. Szeto, and C. Lofdahl, "Enhanced high-speed performance from HDI thin film multichip modules," Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,, San Francisco, CA, USA, 1989, pp. 103B-, doi: 10.1109/EMTS.1989.69004. link
1988
E. Bogatin, "Design rules for microstrip capacitance," in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 11, no. 3, pp. 253-259, Sept. 1988, doi: 10.1109/33.16649. link