Professional Publications

Additional publications can be found on Google Scholar. 

2024

  1. A. Rao, E. Bogatin, M. Piket-May and M. F. Hadi, "Non-TEM Dispersion in Microstrip Structures at High Data Rates," in IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 178-185, 2024, doi: 10.1109/TSIPI.2024.3493817.
     

2023
 

  1. E. Bogatin, "S-parameters for high-speed digital engineers: A beginner’s guide," IEEE Electromagnetic Compatibility Magazine, vol. 12, no. 1, pp. 34-41, 2023.  Available: Link

2022

  1. A. Rao, E. Bogatin, M. Piket-May, D. Schofield, B. Sankarshanan, and A. Srivastava, "Analysis of a TDR technique to measure dielectric constant," in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA, Aug. 1–5, 2022, doi: 10.1109/9889566. Available: Link
     
  2. E. Bogatin, "What’s new in signal integrity and high-speed serial links: Approaching the fundamental limits of copper interconnects," IEEE Microwave Magazine, vol. 23, no. 5, pp. 84-95, 2022, doi: 10.1109/MMM.2022.3148810.  Available: Link

2021

  1. T. W. Lee, F. de Paulis, M. Resso, M. Piket-May and E. Bogatin, "Non-destructive PCB Substrate Height Extraction with Multi-Measurement Technique," 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), Siegen, Germany, 2021, pp. 1-4, doi: 10.1109/SPI52361.2021.9505208.  Available: Link

2019

  1. E. Bogatin, S. Sandler, L. Smith, "Power Distribution Network (PDN) Impedance and Target Impedance," PDNpowerintegrity.com. Available: https://drive.google.com/file/d/1f9RKPz12ENGMFsPvlCUrN6dzO9qU0i0r/view?usp=sharing.

2018

  1. F. Deek, M. Piket-May and E. Bogatin, "Transfer Impedance Drop off in Power/Ground Plane Cavities," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 105-109, doi: 10.1109/EMCSI.2018.8495309.
     
  2. L. Smith and E. Bogatin, "Principles of Power Integrity for PDN Design," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-74, doi: 10.1109/EMCSI.2018.8495411. 

2017 

  1. E. Bogatin, B. Hargin, V. S. S. T. Paladugu, D. DeGroot, A. Koul, S. Baek, and M. Sapozhnikov, "New characterization technique for glass-weave skew," Signal Integrity Journal, Mar. 2, 2017. [Online]. Available: https://www.researchgate.net/publication/327079248. Available: Link
     
  2. E. Bogatin and K. Radhakrishna, "Synthesis of high speed channels from shorter elements," in IEEE Electromagnetic Compatibility Magazine, vol. 6, no. 1, pp. 85-90, First Quarter 2017, doi: 10.1109/MEMC.2017.7931991.   Available: Link
     
  3. H. Barnes, E. Bogatin and J. Moreira, "Development of a PCB kit for s-parameter de-embedding algorithms verification," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA, 2017, pp. 510-515, doi: 10.1109/ISEMC.2017.8077923.  Available: Link
     
  4. M. Resso, E. Bogatin, and A. Vatsyayan, "A new method to verify the accuracy of de-embedding algorithms," in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017, pp. 1-3. Available: Link

2013

  1. E. Bogatin, D. DeGroot, P. Huray, Y. Shlepnev, "Which One is Better? Comparing Options to Describe Frequency Dependent Losses" (2013). Faculty Publications. 1665.
    Available: https://digitalcommons.andrews.edu/pubs/1665
     
  2. E. Bogatin, L. Simonovich, "Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias," [Online]. (2013). Design Con 2013. Available: https://drive.google.com/file/d/1nDuMC021lheYgRGuCnG-bmw620sWHVkj/view?usp=sharing.

2011

  1. E. Bogatin, "Essential principles of signal integrity," IEEE, 2011, doi: 10.1109/MMM.2011.941411.  Available: Link
     
  2. L. Simonovich, E. Bogatin, and Y. Cao, "Differential via modeling methodology," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 722-730, 2011. https://doi.org/10.1109/TCPMT.2010.2103313  Available: Link

2010

  1. A. Ciccomancini Scogna and E. Bogatin, "Analysis of return path discontinuities in multilayer PCBs and their impact on the signal and power integrity," IEEE, 2010. Available: Link
     
  2. E. Bogatin, Signal and Power Integrity—Simplified, 2nd ed. Upper Saddle River, NJ, USA: Prentice Hall PTR, 2010. ISBN: 978-0-13-234979-6.  Available: Link

2009

  1. M. Resso and E. Bogatin, Signal Integrity Characterization Techniques, 2nd ed. Chicago, IL, USA: International Engineering Consortium, 2009. ISBN: 978-1-931695-93-0.  Available: Link

2007

  1. E. Bogatin, "Tracking transmission line losses," Printed Circuit Design & Fab, Jan. 2007. [Online]. Available: https://www.researchgate.net/publication/293520416_Tracking_transmission_line_losses.

2000

  1. E. Bogatin, "A closed-form analytical model for the electrical properties of transmission lines for digital interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, vol. 23, no. 3, pp. 282–289, 2000. Available: Link