Publications
Books:
SI Journals
2019
Making Lemonade with the 10x Scope Probe
Guard Traces: Love Them or Leave Them?
One Chance Decision Changed the EMC Community
Young Professionals Placed in Jeopardy at 2019 EMC Symposium
The New Touchstone Specification 3.0 Awaits for Your Input
Instant Cable Testing and the Surprising Results
Seven Habits of Successful 2-Layer Board Designers
Practical Application of the IEEE P370 Standard for Measurement of Interconnects up to 50 GHz
IEEE P370: A Fixture Design and Data Quality Metric Standard for Interconnects up to 50 GHz
Free Beta Code to Implement Impedance Corrected 2X Thru De-Embedding Algorithm
Just how good are VNA Measurements?
Electric Circuits, a Primer: Essential Building Block Principles for All Electrical Engineers
Avoid These Two Artifacts When Measuring SMPS Power Rails
Quick, Simple Way to Measure the System Bandwidth of a Scope-Probe System
Target Impedance Is Not Enough
2018
Kicking The Bounce Out of Your Circuits
Just How Good Is Your Sine Wave Generator, and How Do You Know?
VRM Modeling: A Strategy to Survive the Collision of Three Worlds
EDI CON Conversations Offer New Insights
State of the Art Laminates Still Have Some Life Left
Impedance: The Most Confusing Term in Signal Integrity
Why On-Die Power-Rail Measurements are Important
How to Measure Shared On-Die Power Rails
Bandwidth, Current Load and Power-Rail Measurements
Mitigate RF Pickup In Power Rails
Back to Basics: Bandwidth and Rise Time
Validating IBIS Models with Measurements
First ever IEEE P370 Plug Fest Draws a Crowd
Two New Open Source Tools for De-embedding
How You Probe a Differential Pair Affects What You Measure
DesignCon PDN Tutorial Challenges the Way We Think About Fundamental Electrical Engineering
Time to Drink from the Firehose Again
Test Drive the IEEE P370 Draft De-Embed Standard
2017
High Speed Digital Symposium Highlights
Winner of the Coolest Product Demo at the 2017 EMC Symposium
Real Time FFT Makes EMI Debug So Much Easier.
Why Do We Care About PDN Design?
Does Coupling Matter in Characterizing the Loss of a Differential Pair?
Beware of Misinterpreting Measurements Without This Key Piece of Information
What Exactly is Power Integrity?
Ten Tips for Best Board Design Practices for IoT Applications
Measuring Glass Weave Skew and the Identification of an Important Hidden Variable Artifact
IEEE P370 Working Group Update
DesignCon
2020
- Differential Pairs Don't Need a Return Path, or Do They?
- Panel – Stump the SI/PI Experts
- S-Parameter Master Class Part 1 with Eric Bogatin - Hands on Lab
- S-Parameter Master Class Part 2 with Eric Bogatin - Hands on Lab
- SI/PI on a Budget: Five Tricks to Get More out of your Oscilloscope
- So You Think You Understand What a TDR Measures
- Tutorial – Introduction to the IEEE P370 Standard & Its Applications for High Speed Interconnect Characterization
- What’s Next? How to Jumpstart Your Career
2018
DesignCon: SI, PI, EMI Have a Future Together
2017
Eric Bogatin at DesignCon 2017
DesignCon Interview 2017: Eric Bogatin
2016
Eric Bogatin at DesignCon 2016
DesignCon 2016 Honors Dr. Eric Bogatin with Prestigious Engineer of the Year Award
2014
Eric Bogatin at DesignCon 2014
Rules of Thumb Published in EDN:
Rules of Thumb #0: Using Rules of Thumb Wisely
Rule of Thumb #1: Bandwidth of a signal from its rise time
Rule of Thumb #2: Signal bandwidth from clock frequency
Rule of Thumb #3 Signal speed on an interconnect
Rule of Thumb #4: Skin depth of copper
Rule of Thumb #5: Capacitance per length of 50 Ohm transmission lines in FR4
Total loop inductance/length in 50 Ohm transmission lines: Rule of Thumb #6
Total inductance in the return path: Rule of Thumb #7
How to estimate ground bounce in a connector: Rule of Thumb #8
Loss in a channel: Rule of Thumb #9
How much attenuation is too much?: Rule of Thumb #10
What is the bandwidth of a high speed serial-link signal?: Rule of Thumb #11
How much return loss is too much?: Rule of Thumb #12
Sheet resistance of copper foil: Rule of Thumb #13
Resistance of a copper trace: Rule of Thumb #14
Estimating wire & loop inductance: Rule of Thumb #15
Sheet inductance of a cavity: Rule of Thumb #16
The quarter-wave stub frequency: Rule of Thumb #17
How long a stub is too long?: Rule of Thumb #18
Crosstalk: How much is too much?: Rule of Thumb #19
How far is far enough? Signal line spacing for acceptable near end crosstalk: Rule of Thumb #20
How to engineer acceptable far-end crosstalk: Rule of Thumb #21
What is the frequency of the S21 dip in microstrip?: Rule of Thumb #22
When to worry about a capacitive discontinuity: Rule of Thumb #23
When to worry about trace corners: Rule of Thumb #24
How much is impedance affected by an adjacent trace?: Rule of Thumb #25
What is the ringing period on an unterminated line?: Rule of Thumb #26
What is the aspect ratio for 50Ω microstrip?: Rule of Thumb #27
What is the aspect ratio for 50Ω stripline?: Rule of Thumb #28
What is the spatial extent of an edge?: Rule of Thumb #29
What is the resonant frequency of a cavity?: Rule of Thumb #30
How much common current is too much?: Rule of Thumb #31
How much mode conversion is too much?: Rule of Thumb #32
EDN Articles
2014
Measure a 75Ω cable with a 50Ω VNA
2013
Glass weave skew problems may be solved
An important secret about transmission lines
So you think you understand transmission lines
Not all common currents are bad
Always a good policy to question authority
Special day for physicists' cats
Characterizing a high-density, controlled impedance test interface
Characterize a high-density, controlled impedance test interface
2012
Use S-parameters to describe crosstalk
Avoid a common S-parameter problem
2008
Making the transition from bit banger to gigabit guru
2004
Analysis of board layout helps cure jitter problems
What you lose from a lossy line
Nuts and Volts
2017
Build a Geiger Counter to Monitor a Radioactive Cat
Build this Professional Grade Data Acquisition System
2016
Make Your LED Dance Just Like a Candle
Why You Need an Analog Front End and How to Set It Up
2015
Power Sources: The Good, the Bad, and the Ugly
Arduino Based Data Acquisition
Other
ANALYSIS OF VIA TO VIA CROSSTALK FOR SINGLE ENDED SIGNALS IN THE TIME & FREQUENCY DOMAINS