2.0—Universal Interfacing Using Suspended Structures

A novel method for hardware integration using atomically assembled, suspended or freestanding microstructures that form mechanical and electrical bonds between components. Fabricated directly onto device surfaces, these nanoscale structures interpenetrate upon mating, creating flexible, conformable bridges that enable seamless connectivity across diverse materials and geometries, without adhesives or precise alignment. This approach overcomes limitations of prior microscale techniques, offering a robust, scalable and universal solution for modular and heterogeneous system design.

Inventor:Victor M. Bright (CU Boulder Paul M. Rady Mechanical Engineering)

Potential Applications: Advanced Materials, Hardware and Instrumentation