Journal Articles Book Chapters US Patents Media Coverage

Journal Articles

  1. A.C. Hayes, G. L. Whiting. Coupled Electromagnetic and Lattice Structure Optimization for the Rotor and Stator of Large Electric Machines. Proceedings of the 2021 ASME Power Conference2021, V001T12A003. (link)
  2. A. C. Hayes, J. Osio-Norgaard, S. Miller, G. L. Whiting, M. E. Vance. Air Pollutant Emissions for Multi-Jet Fusion, Material-Jetting, and Digital Light Synthesis Commercial 3D Printers in a Service Bureau. Building and Environment2021202, 108008. (link)
  3. B. Hayes, G. L. Whiting, R. MacCurdy. Modeling of Contactless Bubble-bubble Interactions in Microchannels with Integrated Inertial Pumps. Physics of Fluids202133, 042002. (link)
  4. J. Osio-Norgaard, A. C. Hayes, G. L. Whiting. Sintering of 3D Printable Simulated Lunar Regolith Magnesium Oxychloride Cements. Acta Astronautica2021, DOI: 10.1016/j.actaastro.2021.03.016. (link)
  5. A. C. Hayes, G. L. Whiting. Reducing the Structural Mass of Large Direct Drive Wind Turbine Generators through Triply Periodic Minimal Surfaces Enabled by Hybrid Additive Manufacturing. Clean Technologies20213, 227. (link)
  6. Y. Sui, M. Atreya, S. Dahal, A. Gopalakrishnan, R. Khosla, G. L. Whiting. Biodegradation of an Addivitely Fabricated Capacitive Soil Moisture Sensor. ACS Sustainable Chemistry and Engineering20219, 2486. (link)
  7. A. C. Hayes, J. Osio-Norgaard, S. Miller, M. E. Vance, G. L. Whiting. Influence of Powder Type on Aerosol Emissions in Powder-Binder Jetting with Emphasis on Lunar Regolith for In Situ Space Applications. ACS Environmental Science and Technology Engineering2021, 1, 183. (link
  8. S. Bahal, W. Yilma, Y. Sui, M. Atreya, S. Bryan, V. Davis, G. L. Whiting, R. Khosla. Degradability of Biodegradable Soil Moisture Sensor Components and their Effect on Maize (Zea mays L.) Growth. Sensors2020, 20, 6154. (link)
  9. M. Atreya, K. V. Dikshit, G. Marinick, J. Nielson, C. Bruns, G. L. Whiting. A Poly(lactic acid)-based Ink for Biodegradable Printed Electronics with Conductivity Enhanced through Solvent Aging. ACS Applied Materials and Interfaces2020, 12, 23494. (link)
  10. A. C. Hayes, G. L. Whiting. Powder-Binder Jetting Large-Scale, Metal Direct-Drive Generators: Selecting the Powder, Binder, and Process Parameters. Proceedings of the 2019 ASME Power Conference2019, V001T12A004. (link)
  11. J. F. Thompson, C. Bellerjeau, G. Marinick, J. Osio-Norgaard, A. Evans, P. Carry, R. A. Street, C. Petit, G. L. Whiting. Intrinsic Thermal Desorption in a 3D Printed Multifunctional Composite CO2 Sorbent with Embedded Heating Capability. ACS Applied Materials and Interfaces,  2019, 11, 43337. (link)
  12. M. Li, G. Daniel, B. E. Kahn, L. H. Ohara, B. D. F. Casse, N. Pretorius, B. S. Krusor, P. Mei, G. L. Whiting, C. Tonkin, D. Lupo. All-Printed, Large-Area E-Field Antenna Utilizing Printed Organic Rectifying Diodes for RF Energy Harvesting.  Proceedings of the 2018 IEEE 18th International Conference on Nanotechnology2018, DOI: 10.1109/NANO.2018.8626318. (link)
  13. P. Mei, G. Daniel, D. E. Schwartz, T. Ng, B. S. Krusor, G. L. Whiting.  Digital Fabrication and Integration of a Flexible Wireless Sensing Device.  IEEE Sensors Journal, 2017, 17, 7114. (link)
  14. G. L. Whiting, D. E. Schwartz, T. Ng, B. S. Krusor, R. Krivacic, A. Pierre, A. C. Arias, M. Harting, D. VanBuren, K. Short.  Digitally Fabricated Multi-Modal Wireless Sensing using a Combination of Printed Sensors and Transistors with Silicon Components.  Flexible and Printed Electronics, 2017, 2, 034002. (link)
  15. D. E. Schwartz, J. Rivnay, G. L. Whiting, P. Mei, Y. Zhang, B. S. Krusor, G. Daniel, S. Ready, J. Veres, R. A. Street.  Flexible Hybrid Electronic Circuits and Systems.  IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 2016, 7, 27. (link)
  16. R. A. Street, T. Ng, D. E. Schwartz, G. L. Whiting, J. P. Lu, R. Bringans, J. Veres.  From Printed Transistors to Printed Smart Systems.  Proceedings of the IEEE, 2015, 103, 607. (link)
  17. P. Y. Maeda, J. P. Lu, G. L. Whiting, D. K. Biegelsen, S. Raychaudhuri, R. Lujan, J. Veres, E. M. Chow, V. Gupta, G. N. Nielson, S. Paap.  Micro Chiplet Printer for Micro-scale Photovoltaic System Assembly.  IEEE 42nd Photovoltaic Specialist Conference, 2015, 1. (link)
  18. S. Ready, G. L. Whiting, T. Ng.  Multi-Material 3D Printing.  Proceedings of the NIP & Digital Fabrication Conference, 2014, 120. (link)
  19. T. Ng, P. Mei, G. L. Whiting, D. E. Schwartz, B. Abraham, Y. Wu, J. Veres.  Comparison of Conductor and Dielectric Inks in Printed Organic Complementary Transistors.  Proceedings of the SPIE, 2014, 9185, 91850X. (link)
  20. J. P. Lu, J. D. Thompson, G. L. Whiting, D. K. Biegelsen, S. Raychaudhuri, R. Lujan, J. Veres, L. L. Lavery, A. R. Vökel, E. M. Chow.  Open and Closed Loop Manipulation of Charged Microchiplets in an Electric Field.  Applied Physics Letters, 2014, 105, 054103. (link)
  21. A. M. Gaikwad, D. A. Steingart, T. Ng, D. E. Schwartz, G. L. Whiting.  A Flexible High Potential Printed Battery for Powering Printed Electronics.  Applied Physics Letters, 2013, 102, 233302. (link)
  22. S. Ready, F. Endicott, G. L. Whiting, T. Ng, E. M. Chow, J. P. Lu.  3D Printed Electronics.  Proceedings of the NIP & Digital Fabrication Conference2013, 9. (link)
  23. N. A. D. Yamamoto, L. L. Lavery, B. F. Nowacki, I. R. Grova, G. L. Whiting, B. Krusor, E. R. de Azevedo, L. Akcelrud, A. C. Arias, L. S. Roman.  Synthesis and Solar Cell Applicaiton of New Alternating Donor-Acceptor Copolymers Based on Variable Units of Fluorene, Thiophene and Phenylene.  The Journal of Physical Chemistry C, 2012, 116, 18641. (link)
  24. T. Ng, D. E. Schwartz, L. L. Lavery, G. L. Whiting, B. Russo, B. Krusor, J. Veres, P. Bröms, L. Herlogsson, N. Alam, O. Hagel, J. Nilsson, C. Karlsson.  Scaleable Printed Electronics: An Organic Decoder Addressing Ferroelectric Non-Volatile Memory.  Scientific Reports, 2012, 2, 585. (link)
  25. A. C. Arias, T. Ng, G. L. Whiting, J. Daniel.  Printed Thin Film Transistor: Materials and Applications.  Proceedings of the SPIE, 2011, 8117, 81170Y-1. (link)
  26. A. M. Gaikwad, G. L. Whiting, D. A. Steingart, A. C. Arias.  Highly Flexible, Printed Alkaline Batteries Based on Mesh-Embedded Electrodes.  Advanced Materials, 2011, 23, 3251. (link)
  27. L. L. Lavery, G. L .Whiting, A. C. Arias.  All Ink-Jet Printed Polyfluorene Photosensor for High Illuminance Detection.  Organic Electronics, 2011, 11, 682. (link)
  28. S. Sambandan, G. L. Whiting, A. C. Arias, R. A. Street.  Fast Polymer Semiconductor Transistor by Nanoparticle Self-Assembly.  Organic Electronics, 2010, 11, 1935. (link)
  29. A. C. Arias, J. Daniel, T. Ng, S. Garner, G. L. Whiting, L. L. Lavery, B. Russo, B. Krusor.  Flexible Printed Sensor Tape Based on Solution Processed Materials.  IEEE 23rd Meeting of the Photonics Society, 2010, 11, 18. (link)
  30. G. L. Whiting, A. C. Arias.  Chemically Modified Ink-Jet Printed Electrodes for Organic Field-Effect Transistors.  Applied Physics Letters, 2009, 95, 253302. (link)
  31. S. Mijalkovic, D. Green, A. Nejim, G. L. Whiting, A. Rankov, E. Smith, J. J. M. Halls, C. E. Murphy.  Modelling of Organic Field-Effect Transistors for Technology and Circuit Design.  IEEE 26th International Conference on Microelectronics, 2008, 469. (link)
  32. K-H. Yim, G. L. Whiting, C. E. Murphy, J. J. M. Halls, J. H. Burroughes, R. H. Friend, J-S. Kim.  Controlling Electrical Properties of Conjugated Polymers via a Solution-Based p-type Doping.  Advanced Materials, 2008, 20, 3319. (link)
  33. C. R. McNeil, J. J. M. Halls, R. Wilson, G. L. Whiting, S. Berkebile, M. G. Ramsey, R. H. Friend, N. C. Greenham.  Efficient Polythiophene/Polyfluorene co-Polymer Bulk Heterojunction Photovoltaic Devices: Device Physics and Annealing Effects.  Advanced Functional Materials, 2008, 18, 2309. (link)
  34. J. C. Pinto, G. L. Whiting, S. Khodabaksh, L. Torre, A. B. Rodríguez, R. M. Dalgliesh, A. M. Higgins, J. W. Andreasen, M. M. Nielsen, M. Geoghegan, W. T. S. Huck, H. Sirringhaus.  Organic Thin Film Transistors with Polymer Brush Gate Dielectrics Synthesized by Atom Transfer Radical Polymerization.  Advanced Functional Materials, 2008, 18, 36. (link)
  35. G. L. Whiting, H. J. Snaith, S. Khodabakhsh, J. W. Andreasen, D. W. Brieby, M. M. Nielsen, N. C. Greenham, R. H. Friend, W. T. S. Huck.  Enhancement of Charge Transport Characteristics in Polymeric Films using Polymer Brushes.  Nano Letters, 2006, 6, 573. (link)
  36. H. J. Snaith, G. L. Whiting, B. Sun, N. C. Greenham, W. T. S. Huck, R. H. Friend.  Self-Organization of Nanocrystals in Polymer Brushes.  Application in Heterojunction Photovoltaic Devices.  Nano Letters, 2005, 5, 1653. (link)
  37. W. U. Huynh, J. J. Dittmer, W. C. Libby, G. L. Whiting, A. P. Alivisatos.  Controlling the Morphology of Nanocrystal-Polymer Composites for Solar Cells.  Advanced Functional Materials, 2003, 13, 73. (link)

Book Chapters

  1. R. A. Street, T. Ng, S. E. Ready, G. L. Whiting.  Printing Techniques for Display Fabrication.  In Handbook of Visual Display Technology.  C. Janglin, W. Cranton, M. Fihn, Eds., Springer, 2015, pp 1289-1303. (link)
  2. G. L. Whiting, T. Farhan, W. T. S. Huck.  Polymer Brushes:  Towards Applications.  In Polymer Brushes: Synthesis, Characterization, Applications.  R. C. Advincula, W. J. Brittain, K. C. Caster, J. Rühe, Eds., Wiley-VCH, 2004, pp 371-380. (link)

US Patents

  1. 10,903,176 (2021) - Method of Forming a Photodiode (link)
  2. 10,903,173 (2021) - Pre-Conditioned Self-Destructing Substrate (link)
  3. 10,818,842 (2020) - Selective Surface Modification of OTFT Source/Drain Electrodes by Ink-Jetting F4TCNQ (link
  4. 10,740,577 (2020) - Passive Sensor Tag System (link)
  5. 10,490,746 (2019) - Selective Surface Modification of OTFT Source/Drain Electrodes by Ink-Jetting F4TCNQ (link
  6. 10,466,193 (2019) - Printed Gas Sensor (link)
  7. 10,332,717 (2019) - Self-Limiting Electrical Triggering for Initiating Fracture of Frangible Glass (link)
  8. 10,283,725 (2019) - Organic Schottky Diodes (link)
  9. 10,262,954 (2019) - Transient Electronic Device with Ion-Exchanged Glass Treated Interposer (link)
  10. 10,224,297 (2019) - Sensor and Heater for Stimulus-Initated Fracture of a Substrate (link)
  11. 10,206,288 (2019) - Bare Die Intergation with Printed Components on Flexible Substrate (link)
  12. 10,202,990 (2019) - Complex Stress-Engineered Frangible Structures (link)
  13. 10,199,586 (2019) - Device Comprising Dielectric Interlayer (link)
  14. 10,178,447 (2019) - Sensor Network System (link)
  15. 10,165,677 (2018) - Bare Die Integration with Printed Components on a Flexible Substrate without Laser Cut (link)
  16. 10,014,261 (2018) - Microchip Charge Patterning (link)
  17. 10,012,250 (2018) - Stress-Engineered Frangible Structures (link)
  18. 9,952,082 (2018) - Printed Level Sensor (link)
  19. 9,886,862 (2018) - Automated Air Traffic Communications (link)
  20. 9,780,044 (2017) - Transient Electronic Device with with Ion-Exchanged Glass Treated Interposer (link)
  21. 9,629,252 (2017) - Printed Electronic Components on Universally Patterned Substrate for Integrated Printed Electronics (link)
  22. 9,594,039 (2017) - Photometric Enthalpy Change Detection System and Method (link)
  23. 9,579,904 (2017) - System and Method for Thermal Transfer of Thick Metal Lines (link)
  24. 9,473,047 (2016) - Method for Reduction of Stiction while Manipulating Micro-Objects on a Surface (link)
  25. 9,431,283 (2016) - Direct Electrostatic Assembly with Capacitively Coupled Electrodes (link)
  26. 9,396,972 (2016) - Micro-assembly with Planarized Embedded Microelectronic Dies (link)
  27. 9,356,603 (2016) - Thermally Tempered Glass Substrate using CTE Mismatched Layers and Paste Mixtures for Transient Electronic Systems (link)
  28. 9,356,248 (2016) - n-Type Organic Thin-Film Transistor using Semiconductor Blend (link)
  29. 9,305,807 (2016) - Fabrication Method for Microelectronic Components and Microchip Inks used in Electrostatic Assembly (link)
  30. 9,219,126 (2015) - High-k Dielectrics with a Low-k Interface for Solution Processed Devices (link)
  31. 9,154,138 (2015) - Stressed Substrates for Transient Electronic Systems (link)
  32. 8,884,156 (2014) - Solar Energy Harvesting Device using Stimuli-Responsive Material (link)
  33. 8,872,224 (2014) - Solution Processed Neutron Detector (link)
  34. 8,735,871 (2014) - Cross-Linked Fluorinated Dielectrics for Organic Thin Film Transistors (link)
  35. 8,685,769 (2014) - Microchip Charge Patterning (link)
  36. 8,642,379 (2014) - Oxidized Contacts for Thin Film Transistors (link)
  37. 8,502,356 (2013) - Controlled Semiconductor Crystallization in Organic Thin Film Transistors (link)
  38. 8,481,994 (2013) - Contact Doping for Organic Thin Film Transistors (link)
  39. 8,481,360 (2013) - Vertical Channel Organic Thin Film Transistor (link)
  40. 8,450,142 (2013) - Containment of Organic Semiconductor in Thin Film Transistors (link)
  41. 8,430,705 (2013) - Self Assembly of Field Emission Tips by Capillary Bridge Formations (link)
  42. 8,394,665 (2013) - Contact Treatments for Organic Thin Film Transistors (link)
  43. 8,089,065 (2012) - Self Aligned Process for Organic Thin Film Transistors (link)
  44. 8,053,818 (2011) - Thin Film Field Effect Transistor with Dual Semiconductor Layers (link)
  45. 8,040,609 (2011) - Self-Adjusting Solar Light Transmission Apparatus (link)

Selected Media Coverage

  1. Cheap Sensors for Smarter Farmers (2021): IEEE Spectrum
  2. Seed grant could lead to materials needed for unconventional computing revolution (2021): CU Boulder
  3. Biodegradable sensors aim to make farming more effecient (2020): June/July 2020 issue of New AG International
  4. CU researchers to explore 3D printing in reduced gravity with NASA grant (2020): CU Boulder
  5. Creating the Internet of Living Things (2019): CU Boulder
  6. ARPA-E Award for Agricultural Sensors (2019): Boulder Daily Camera, CU Boulder, Press release from US Senators Gardner and Bennet
  7. Transient electronic systems based on stress engineered glass (2015): IDG News Service, IEEE Spectrum, Engadget, Popular Mechanics, Gizmodo, LiveScience, and others.
  8. Printed hybrid electronic systems for space applications (2013): GigaOM
  9. Electrostatic microassembly for micro manufacturing (2013): New York Times