Newell Moser

Project Description:

The associate designs and executes new experiments to enhance X-Ray computed tomopgraphy (XCT) measurements of advanced semiconductor packages in support of the CHIPS effort. The associate performs XCT measurements under various external stimuli (electrical, mechanical, thermal) to reveal defects. The associate works with internal collaborators on manual and automated image processing, segmentation and shape analysis. In addition, the associate deploys Causal Green’s functions to model thermal transport in gate all around transistors. The associate establishes new software routines to improve adoption of Causal Green’s functions in multiscale/multiphysics modeling. 

Research Interests:

Strength of materials, additive manufacturing, computational modeling, advanced packaging, computed tomography

CV