Emerging Innovations Insider: September 2018

Researchers at Kelvin Thermal Technologies, Inc. have developed the world’s thinnest vapor chambers for cooling smartphones, using technologies originally developed at CU Boulder. With thickness less than 0.15 mm, these vapor chambers can spread 15 Watts from a chip to a 10cm x 5cm area with only 2oC difference.

Prof. Christopher Bowman's group has designed a novel thioester monomer system that can be seamlessly incorporated into existing polymerization procedures and allows for extremely rapid, room-temperature plasticity under ambient conditions, offering a route towards recycling and remolding.

Researchers working at CU Boulder and NIST have developed an electroplated rhenium film that is superconducting at relatively high critical temperatures of up to 6K, which is well above the boiling point of liquid helium, making the critical temperature easy to obtain.

Researchers working at CU Boulder and Immodulon Therapeutics Limited have discovered novel, mycobacterially-derived lipid compounds that have potent anti-inflammatory effects and could be useful in the treatment and prevention of sepsis and post-sepsis syndrome.