Micro Automation M1006 Dicing Saw

Instrument/ServiceType:

Wafer Dicing Saw

Make/ Model:

Micro Automation M1006

Instrument Description:

Used for dicing or scribing glass, sapphire, and semiconductor substrates using a high-speed diamond blade.

Keywords for the Instrument:

Wafer dicing, wafer scribing, diamond blade cutting, wet saw

Instrument Website:

http://jila-kecklab.colorado.edu

Primary Contact Name:

David Alchenberger

Email: alchenbd@jila.colorado.edu

Phone: 303.492.2389

Instrument Home Department/Institute:

JILA

Home Facility:

JILA Keck Lab

Instrument Location:

JILA S105

Instrument Availability:

Open on a case-by-case basis to the university users outside of the home department

Open on a case-by-case basis to academic and national lab users