Equipment
CVC Thermal Evaporator
3 boat thermal evaporation chamber with deposition rate monitored by quartz crystal monitor. Commonly evaporated metals include gold, chrome, titanium and copper.
Magnetron Reactive Sputter
Sputter tool capable of depositing a wide range of metals. Large batch size.
Available targets include copper, tungsten, chrome, ITO, Hf, aluminum.
Reactive Etching 1
Capacitively coupled RIE system flowing SF6, CF4, O2 and Ar. Base pressure 50 mTorr, maximum power 400W. Commonly used to etch SiO2 and activate polymers.
Laurel Spin Coaters
Two programmable spin coaters, max wafer diameter of 100mm. Max speed 6000 rpm
Karl Suss MJB3 Mask Aligner
100mm mask holder, can align up to a 75mm wafer. 2um alignment precision. Mercury lamp.
Heidelberg DWL 66FS
Writes 100mm masks standard with precision up to 1um. Readable file formats are .CIF, .DXF, .GSDII.
Dektak 6M Profilometer
12.5 um scanning tip, can characterize a wide range of step heights.
Olympia Microscope
Optical microscope with front side and back side illumination, camera to capture images.
Oxidation Furnace
5” diameter tube furnace max temperature 1100 degrees. Capable of either wet or dry oxidation.
Annealing furnace
5” diameter tube furnace. Temperatures ranging from 250 C to 1100 C, can flow nitrogen or argon to purge tube.
Graphene Furnace
4” diameter tube furnace flowing argon, hydrogen, methane for depositing graphene and graphitic carbon layers.
Apex Etcher
Inductively coupled RIE with Cl 2 and BCl 3 chemistry.
Wet processing bench
Positive and negative resist process development and spinners.