FESEM: Field Emission Scanning Electron Microscope JEOL JSM-7401F

A field emission scanning electron microscope (FESEM), has a beam cross section close to one nanometer in diameter. This microscope features a cold cathode field emission gun. Two secondary electron detectors are installed: an in-lens detector for very high resolution and a lens backscatter electron detector. Acceleration voltages range from 0.1 to 30kV with a special sample bias voltage option that helps eliminate surface charging. Also installed on this microscope is an energy dispersive X-ray spectrometer (EDS), to perform elemental analysis on most samples. It is capable of elemental mapping as well as line scans and automated point to point measurements.

The Electron microscope next to a computer.

SEM: Hitachi SU3500 with E-beam writing capability

The SU3500 Scanning Electron Microscope features innovative electron optics and signal detection systems to provide unparalleled imaging and analytical performance. Engineered for a wide range of applications including biological specimens and advanced materials, the SU3500 is workhorse microscope with the following key capabilities:

  • W-thermiomic emission SEM
  • 7 nm SE Image Resolution at 3 kV, 10 nm BSE Image resolution at 5 kV.
  • Ultra Variable-Pressure Detector: Image surface information at low vacuum and low accelerating voltages
  • Stereoscopic Image Function: Point and click for seamless, real-time "3D" image observation.
  • NPGS electron beam lithography capability
  • Electron backscatter diffraction (EBSD)

SU3500 Scanning Electron Microscope next to a computer.

FIB: Focused Ion Beam: FEI Nova 600 Nanolab (Dual Beam)

The FEI Nova 600i focused ion beam (FIB) is a dual beam system consisting of a field emission scanning electron microscope (SEM) and a scanning Gallium ion beam. This system can be used for a number of micrometer/nanometer scale machining tasks. These tasks range from transmission electron microscopy (TEM) sample preparation to micromachining and repairing micro electrical mechanical systems (MEMS). It also allows working with natural samples, such as geological specimens. Image magnification using the SEM can be greater than 500,000 times depending on the sample. The FIB system also includes: a digital patterning engine to fabricate complex 3D patterns, a multiple gas injector system for deposition as well as selective etching, and a computer controlled nanometer resolution manipulator for picking and placing individual segments to fabricate 3D nanostructures.

The key features are:

  • Schottky field emitter for imaging
  • Gallium beam for machining
  • Micro-manipulator
  • Metal deposition including Pt
  • TEM sample preparation
  • Electron backscatter diffraction (EBSD)

The FEI Nova 600i focused ion beam

AFM: Nanosurf easyScan2 Atomic Force Microscope
STM: Nanosurf easyScan2 Scanning Tunneling Microscope

Nanosurf’s easyScan series is a Modular Scanning Probe Microscopy System with AFM (110μm and 10μm scan heads) and STM.

SPECP: Shimadzu UV-VIS-NIR Spectrophotometer UV-3101

This is a Research-grade UV-VIS-NIR spectrophotometer. The MPC-3100 features many attachments for measuring reflectance and transmittance at several angles, permitting measurement at high energy throughput and at ranges from 190nm to 3200 nm.

This instrument can be used in the following modes:

  • Absorbance/transmittance with MPC-3100
  • Relative specular reflectance with MPC-3100 (shiny samples)
  • Diffuse reflectance with MPC-3100 (non-shiny samples)
  • Absorbance/transmittance without MPC-3100 (liquid samples)

UV-VIS-NIR spectrophotometer

SURFP: Dektak 3030 profilometer

The Dektak 3030 has an Angstrom resolution. In optimal circumstances it can measure steps smaller than 5 nm with stylus forces as low as 1 mg. This profile characterization tool is equipped with a 12.5um stylus. It is placed on a Vibraplane isolation table for more accurate measurements.

Dektak 3030 profilometer

OPM: Optical Microscope, Nikon LV 150

The general purpose optical microscope comes with long working distance objectives and 3.3MPix camera to obtain brightfield, dark field, and polarizing contrast images.

Optical Microscope

SPC1: Sputter Coaters

2 sputter coaters with gold and Platinum target to coat your samples prior to imaging

Sputter CoatersSputter Coater from the front

CARC: Carbon Coater

To coat your samples with charge dissipating carbon (arc) with a carbon layer prior to imaging

CPD: Critical Point Dryer (EMS 850)

The EMS 850 Critical Point Dryer is designed for use with CO2 , having first replaced any water in the specimen by a series of dehydration, often in the same fluid such as Acetone, which will also be the intermediate fluid.

VACD: Vacuum Dryer

A turbo backed vacuum chamber is used to out-gas samples prior to using them in the vacuum chambers of the microscopes.

ASHER: International Power Corporation Asher/Stripper

This tool is used to remove photoresist and other organic layers.
Measured etch rates:

  • PMMA: 48 nm/min @ 10 Torr, 100W, 70 sccm O2

International Power Corporation Asher