Information Technology

Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), continued

Professor Y.C. Lee, at left, graduate student Ramesh Ramadoss, center, and Professor Victor Bright look at a poster of three-dimensional novel MEMS devices that have been assembled at CAMPmode.

The center's research is currently organized around area array packaging, RF/mm-wave design methodologies, and RF microelectromechanical systems (MEMS). In area array packaging, the focus is on concurrent electrical, thermal and mechanical modeling of flip-chip, ball grid array and chip scale packaging technologies. In design, our research activities, based on CAD methodology, focus on modeling, analysis, and optimization techniques for efficient design of high-speed digital-microwave modules.

In our recent area of emphasis, RF MEMS, our focus is on complex, state-of-the-art MEMS, which are flip-chip mounted to a RF substrate. MEMS are important new "packaging" elements for tuning circuits, adjusting optical alignment, testing circuits, sensing package performance and reliability, and a host of other applications. The center has been remarkably successful in attracting federal research funds in this area. Since our entry into this area in 1997, CAMPmode has been awarded over $6 million in research grants.

Faculty members from the Departments of Mechanical Engineering, Electrical and Computer Engineering, and Aerospace Engineering Sciences participate in the center's activities and research programs. CAMPmode was launched in 1992, and became an official NSF I/UCRC in July 1995. It has successfully completed the first five-year phase of funding from NSF and has been renewed for the next five years.

http://saagar.colorado.edu