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Department of Mechanical Engineering

Yung-Chen "YC" Lee

Professor and Director, iMINT Center
(303) 492-3393
Leeyc@Colorado.EDU
Personal Website
Curriculum Vitae

Education

  • Ph.D. Mechanical Engineering, University of Minnesota, 1984
  • M.S. Mechanical Engineering, University of Minnesota, 1982
  • B.S. Mechanical Engineering, National Taiwan University, 1978

Professional Recognition

  • GOMACTech-03 Meritorious Paper Award, Govern. Micro. Appli. Conf, 2003.
  • IEEE Transactions on Advanced  Packaging Honorable Mention Paper Award, 2003
  • ASME Fellow, December 2002.
  • Outstanding Paper Award, ASME J. of Electronic Packaging, 1993.
  • Outstanding Young Manufacturing Engineer Award, SME, 1992.
  • Outstanding Paper Award, IEEE Electronic Component & Tech. Conf., 1991.
  • Presidential Young Investigator Award, NSF, 1990-94.

Research Interests

  • Novel microsystems for engineering and biomedical applications
  • Packaging and integration of electronic, optical, MEMS and NEMS
  • MEMS for optical and RF microsystems and lab-on-a-chip for instant biopsy
  • Solder self-alignment coupled with MEMS for precision assembly of optoelectronics
  • Thermosonic bonding for one-step assembly of low-cost modules.

Novel microsystems in the 21st century will consist of microelectronic, radio frequency (RF), optical, microelectromechanical systems (MEMS), and nanoelectromechanical systems (NEMS) components. It is very challenging to package and interconnect these components for system integration.  Dr.  Lee's research interests are to explore novel microsystems, e.g.  micro-cryocooler for THz imaging and tissue-based lab-on-a-chip for instant biopsy. He also conducts studies to improve design, fabrication, assembly, and testing of the MEMS/NEMS components for these novel systems. Specifically, his focus is on the use of atomic layer deposition for the improvement. In addition to his own research, Dr. Lee leads research teams as the Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT) and the Administrative Director of Nanomaterials Characterization Facility (NCF).

Selected Publications

  • MEMS Capacitive Series Switch Fabricated Using PCB Technology, Ramesh Ramadoss, Simone Lee, Y. C. Lee, V. M. Bright, and K. C. Gupta, International Journal of RF and Microwave Computer Aided Engineering, accepted for publication in 2007.
  • Asymmetric Dielectric Trilayer Cantilever Probe for Calorimetric High Frequency Field Imaging,  S. Lee, T. M. Wallis, J. Moreland, P. Kabos, and Y. C. Lee, IEEE/ASME  Journal of Microelectromechanical Systems, accepted for publication in 2007.
  • MEMS Packaging and Reliability, Y. C. Lee, Chapter 11 in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Ed. by Ephraim Suhir, C. P. Wong and Y. C. Lee, Springer, January 2007, pp. 299-320.
  • Near-field imaging of high-frequency magnetic fields with calorimetric cantilever probes, S. Lee, Y. C. Lee, T. M. Wallis, J. Moreland, and P. Kabos, J. Appl. Phys. 99, 08H306, 2006.
  • RF-MEMS Capacitive Switches Fabricated Using Printed Circuit Processing Techniques, Ramadoss, R.; Lee, S.; Lee, Y. C.; Bright, V. M.; Gupta, K. C.; IEEE/ASME Journal of Microelectromechanical Systems, 2006, pp. 1595 – 1604.
  • Soldering Technology for Optoelectronic Packaging, Qing Tan, Y. C. Lee and Masataka Itoh, Chapter 5 in Passive Micro-Optical Alignment Methods, ed. R. and S. Boudreau, CRC Press, 2005.