Associate Professor and Sanders Faculty Fellow
- Ph.D. Mechanical Engineering, MIT, 2006
- M.S. Mechanical Engineering, University of California at Los Angeles, 2001
- MEng Engineering Thermophysics, Tsinghua University, Beijing, China, 1999
- B.S. Thermal Engineering, Xi’an Jiaotong University, Xi’an, China, 1996
- 2009-2014 CAREER Award, National Science Foundation
- 2008 Technology Review’s TR35 Award (one of the 35 young scientists and technologists in world who are under the age of 35, but their work--spanning medicine, computing, communications, electronics, nanotechnology, energy, and more--is changing our world.)
- 2008 DARPA/MTO Young Faculty Award (one of the 39 rising stars in university microsystems research)
- 2008-2011 Sanders Faculty Fellow, College of Engineering and Applied Science, CU-Boulder.
- 2008 Outstanding Research Award, Department of Mechanical Engineering, CU-Boulder
- 2008 Nominated for IEEE/ACM William J. McCalla ICCAD 2008 Best Paper Award by the conference organizers of the 2008 International Conference on Computer-Aided Design.
- 2005 Best Paper Award – Research, InterPACK 2005 (the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems), 1 out of >500 papers.
- 2005 Goldsmid Award for Excellence in Research in Thermoelectrics, the sole award by the International Thermoelectrics Society.
- 2004 NASA Certificate of Recognition for a Technical Innovation (Space Act Tech Brief Award), NASA Inventions and Contributions Board.
- Micro/Nanoscale and Ultrafast Transport Phenomena
- Micro- and Nanotechnology for Energy Conversion and Storage
- Thermal Management of Electronic and Optoelectronic Devices
- Nanostructured Materials (Nanocomposites, Hybrid Micro/Nano-strucured Materials)
- MEMS/NEMS and Micro/Nanofabrication.
- Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Keith Nelson, Nanoscale Heat Transport Probed with Soft-X-Rays, Paper CWA6, OSA Conference on Lasers and Electro-Optics and the Quantum Electronics and Laser Science Conference (CLEO/QELS), May 2008, San Jose, CA, highlighted as Physics Update in the monthly American Physical Society member magazine Physics Today in July 2008 issue, p.17 (July 2008).
- Nicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick and Ronggui Yang, “ThermalScope: Multi-scale Thermal Analysis for Nanometer-scale Integrated Circuits,” submitted to IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, September 2008
- Ming-Shan Jeng, Ronggui Yang, David W. Song, and Gang Chen, Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites using Monte Carlo Simulation, ASME Journal of Heat Transfer, Vol. 130, Article #042410 (1-11), April 2008.
- Weixue Tian and Ronggui Yang, Phonon Transport and Thermal Conductivity Percolation in Random Nanoparticle Composites (Invited Paper), Computer Modeling in Engineering and Sciences (CMES), Vol. 24, p.123-141, 2008.
- M. S. Dresselhaus, G. Chen, M.Y. Tang, R.G. Yang, H. Lee, D.Z. Wang, Z. F. Ren, J. P. Fleurial, and P. Gogna, New Directions for Low Dimensional Thermoelectric Materials (Invited Review), Advanced Materials 19, pp.1043-1053, April 2007.
- Ronggui Yang, Gang Chen, and Mildred S. Dresselhaus, Thermal Conductivity of Simple and Tubular Nanowire Composites in the Longitudinal Direction, Physical Review B 72, 125418, 2005.
- Ronggui Yang, Gang Chen, and Mildred Dresselhaus, Thermal Conductivity Modeling of Core-Shell and Tubular Nanowires, Nano Letters, Vol. 5, pp. 1111-1115, June 2005.
- Ronggui Yang, Gang Chen, Marine Laroche, and Yuan Taur, Multidimensional Transient Heat Conduction at Nanoscale using the Ballistic-Diffusive Equations and the Boltzmann Equation, ASME Journal of Heat Transfer, Vol. 127, pp.298-306, 2005.
- Ronggui Yang and Gang Chen, Thermal Conductivity Modeling of Periodic Two-Dimensional Nanocomposites, Physical Review B, Vol. 69, 195316 (1-10), 2004.
- Ronggui Yang, Gang Chen, G. Jeffrey Snyder, and Jean-Pierre Fleurial, Multistage Thermoelectric Micro Coolers, Journal of Applied Physics, Vol. 95, pp. 8226-8232, 2004.