Flexbible Thermal Ground Plane
PIs: Victor M. Bright, Y.C. Lee, Rongui Yang
Student: Christopher Oshman
Project field/specialty: Thermal/ Micro Fluidics, MEMS Fabrication
Project Description:
My research project involves the fabrication of a flat, flexible micro/nano heat pipe for electronics cooling applications. A heat pipe is a closed vessel containing a two phase fluid and a liquid wicking structure. Heat conducted through the shell of the vessel evaporates the liquid in the wick. The vapor expands to the cooler side of the vessel where it then condenses. The condensate is then drawn back to the evaporator through capillary forces developed between the wick and liquid. This is the heat pipe cycle.
The FTGP will combine micro and nano liquid wicking structures to allow operation at extreme g-forces will be able to transfer heat with high efficiency using the principles of heat pipe operation.
Funding Source: DARPA
