Multidisciplinary Engineering Micro-Systems Group
 Mechanical Engineering: University of Colorado at Boulder
     
 

Funded Research Projects

  1. DARPA/MTO, “Feasibility Study and Demonstration on a Microtechnology Enabled Air Mover (MEAM),” May 2009-Nov. 2009.
  2. Univ. of Colo TTO POCg, “A Micro-scale Hybrid Wick Heat Pipe Cooling System for High Concentration Photovoltaic Cell,” 1/13/2009-2/28/2010.
  3. SRC, “Nanostructured 3-D Solid-State Rechargeable Batteries,” 9/19/2008-9/18/2009.
  4. DARPA iMINT Center, “GaN-Nanowire/ALD Composite Nano Electromechanical Resonators,” 4/1/2008-3/30/2009.
  5. DARPA, “Flexible Thermal Ground Plane with Micro/Nano-Scaled Wicking Structure,” 4/1/2008-9/30/2009.
  6. NSF MAST Center, “Membrane-Integrated Sensors for Real-Time Monitoring of RO Membrane Performance,” 1/1/2008-12/31/2010.
  7. CU/NIST seed grant, “Nanometer-scale Manipulation  and Assembly of Biomolecules Using a Microfabricated Magnetic Transducer Platform,” 8/1/07-7/31/08.
  8. DARPA, “Fundamental Research and Development on NEMS Switches to Enable NEMS/CMOS Integration and All Mechanical Computing Architectures,” 6/4/2007-6/30/2009.
  9. DARPA, “Focus Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers,” Phase I: 09/13//06-09/12/09.
  10. DARPA, “ALD-Based Dielectric and Conductive Nano-Electro-Mechanical Systems for CMOS Circuits,” 7/06 – 6/07.
  11. CEAS Dean’s Seed Funding, “Photonic Crystal Fiber Based Micro Heat Pipe Arrays and Micro Capillary Pumped Loops,” 06/06 – 12/06.
  12. DARPA, “Photonic Crystal Fiber-Enabled Micro Cryogenic Coolers for Terahertz Imagers Utilizing Superconducting Hot Electron Bolometers,” 02/2006-01/2009.
  13. NSF, “Ultrasonic MicroSensors for In-Situ Monitoring of Membrane Biofouling,” 10/1/05-10/31/08.
  14. Teledyne Scientific and Imaging, LLC and DARPA, “MEMS, Thermal Management and RF Studies for Chip-Scale Atomic Clocks,” Award B6U517361; 9/1/2005-2/1/2007.
  15. Raytheon, CAMPmode, “ALD nano-electro-mechanical systems”, 3/05-6/07.
  16. DARPA, “Atomic Layer Deposited Nano-scale Films and Processes for Encapsulated and Robust Micro- and Nano Electro-Mechanical Systems,” 7/1/2004- 6/30/2005.
  17. ARO (DARPA), “Integrated Atom Chip Enabling Technology for Precision Inertial Navigation Sensors,” Feb/2004-May/2009.
  18. NSF-Major Research Instrumentation Program: Instrument Development and Acquisition, “Acquisition of a Nanoindentor System for Micro/Nanosystems Research and Education Efforts,” Sept. 2003 – Aug. 2004.
  19. DARPA and AF Wright-Patterson AFB, "ALD Coatings for Reliable RF MEMS Switches," 8/1/2002-1/9/2004.
  20. DARPA, “MEMS and Packaging for Chip-Scale Integration for Atomic Clocks,” Award NBCH102008 6/11/2002-4/30/2006.
  21. AFOSR, "Topology Optimization for the Design of 3-D MEMS Undergoing Coupled Multiphysics Phenomena," 2002-2004.
  22. NSF CAMPmode, University of Colorado, “Using Atomic Layer Deposition (ALD) for Ultra-Thin Custom Surface Micromachined MEMS,” 2002-2003.
  23. Zyvex, Co., “Assembly and Packaging of Zyvex Micro-Electro-Mechanical Systems,” 2002-2003.
  24. DARPA, “Micro-Packages for Nano-Devices,” extension proposal to the previous grant “Injectable Ceramic Microcast SiCN MEMS for Extreme Temperature Environments," 4/2/2002-8/29/2003.
  25. AFOSR, “Optically Holographic Interferometric Vapor Sensor Arrays,” 2/1/01-12/31/03.
  26. DARPA and Rockwell Science Center, “Micromirror Array Device Design,” 7/16/2001-11/30/01.
  27. NSF, “Acquisition of a Particle Image Velocimetry System,” 11/1/01-10/31/02.
  28. NSF MAST, University of Colorado at Boulder, “Use of Microsensors for the In Situ Quantification of Membrane Fouling and Cleaning,” 1/1/01-12/31/03.
  29. NSF, “Development of an Optoelectronic Microsystems Education Resource Center,” 1/1/01-12/31/03.
  30. AFOSR, DURIP Program, "Photo-Stereo Lithography for Polymer Derived Ceramic Microsystems," 2002.
  31. Network Photonics Inc., Boulder, CO, “Optical MEMS,” 2000-2001.
  32. DARPA, “MEMS for Steered Agile Beams,” 5/1/2000-4/30/2004.
  33. DOD Navy ONR, MURI Program, “Ultracold Atom Optics Science and Technology,” 5/1/2000-4/29/2005.
  34. NASA, “Microelectromechanical Linear Actuators,” 1/1/2000-12/31/2000.
  35. DARPA, "Injectable Ceramic Microcast SiCN MEMS for Extreme Temperature Environments," 1999-2002.
  36. Sandia National Laboratories, “Fabrication and Flip-Chip Integration of MEMS Mirror Arrays with Control Electronics,” 3/15/2000-12/31/2000.
  37. DARPA, “Integrated MEMS for Steering Smart Pixel Array Output Beams,” 11/1/1999-1/31/2002.
  38. SRC, “Free Space Interconnects with MEMS Enhanced Alignment for Microelectronics,” 1999-2000.
  39. Watkins-Johnson Co., “ A High-Q Variable Oscillator and Preselector Using RF MEMS,” 1999-2000.
  40. Maxwell Technologies, Co., “MEMS High Density Connector Designs,” 11/1/98-10/31/99.
  41. Sandia National Laboratories, “Advanced Modeling and Fabrication Consultation for MEMS Micromirror Projects”, 1/6/99-4/30/99.
  42. DARPA, "Programmable Aperture MEMS-Interconnected Antenna Array Using Printed Circuit Technology," 1999-2002.
  43. NSF CAMPmode, University of Colorado, “General Purpose RF MEMS Tuner,” 1999-2000.
  44. High-Q Tunable Capacitors Using MEMS for Millimeter-Wave Applications,” 8/28/1998-12/29/2002.
  45. University of Colorado Biomedical-Engineering Research Start-Up Grant, “Development of MEMS-based Hemodynamic Sensors,” 7/1/98-6/30/99.
  46. AFOSR, “Micromirror Arrays for High Energy Applications,” 1998-2000.
  47. DARPA, “MEMS and Solder Self-assembly for 3-D MEMS and MEMS Arrays,” 1998-2001.
  48. University of Colorado Start-Up Funds, 1998-2001.

 
 
 

Last Updated: July 2010
© 2008 Victor M. Bright. All Rights Reserved.